Scale at Speed™
Engineering Simulations Redefined
ADVENTURECluster is a next‑generation CAE/HPC solution designed to help manufacturers accelerate innovation and reduce costs by enabling massive simulations with speed, accuracy, and scalability. Developed by Allied Engineering Corp. (SCSK Group, Japan) and commercialized in 2001, it continues to evolve from its roots in the ADVENTURE PROJECT.
MoreADVENTURECluster is a next‑generation CAE/HPC solution designed to help manufacturers accelerate innovation and reduce costs by enabling massive simulations with speed, accuracy, and scalability. Developed by Allied Engineering Corp. (SCSK Group, Japan) and commercialized in 2001, it continues to evolve from its roots in the ADVENTURE PROJECT.
With capabilities in large‑scale assemblies, high‑speed computation, nonlinear analysis, and advanced optimization, ADVENTURECluster empowers industries such as automotive, electronic components, and heavy machinery to achieve superior product accuracy and reliability.
Through Tech Mahindra’s global partnership, ADVENTURECluster is now available worldwide, combining Japanese engineering excellence with Tech Mahindra’s global delivery capabilities.
LessCore Product Modules
Solution Benefits
Designed to solve the toughest simulation challenges across manufacturing. Its modules and solver technology support key manufacturing applications where speed, scale, and accuracy are critical.
Enables manufacturers to address complex engineering and product development challenges through high-speed, large-scale simulation and optimization. Its modules and solver technology support manufacturing applications where speed, scale, and accuracy are critical.
- Press Forming: Accurate mold stress and deformation analysis for improved dimensional precision.
- Die Casting: Thermal stress, burr formation, and fatigue evaluation to extend mold life.
- Injection Molding: Product release, ejector pin stress, and creep analysis for higher quality output.
- Large‑Scale Assemblies: Tens of millions of elements analyzed in practical time with high parallel efficiency.
- Electronics Component Cooling & Heavy Machinery: Thermal management and stress analysis for reliable performance under extreme conditions.
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